More information on ELID grinding of silicon wafers can be found in a review paper devoted to the topic [18]. Use of etched-wafer fine grinding in a process flow requires capital investment ...

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Liu WJ, Pei ZJ, Xin XJ (2002) Finite Element Analysis for Grinding and Lapping of Wire-sawn Silicon Wafers. Journal of Materials Processing Technology 129(1–3):2–9. [106] Liu JH, Pei ZJ, Fisher GR (2007) Grinding Wheels for Manufacturing of Silicon Wafers: A Literature Review.

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Electrolytic in-process dressing (ELID) is the most suitable process for dressing metal-bonded grinding wheels during the grinding process. ELID is one of the processes used for atomic level metal removal and nano-surface finish. Nano-grinding has become an important parameter in the semiconductor, optical, electric and mechanical industries.

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An experimental investigation into micro ball end-milling of silicon. ... By Muhammad Arif. A review on the current research trends in ductile regime machining. By M. Rahman and dennis Neo. Analytical model to determine the critical feed per edge for ductile–brittle transition in milling process of brittle materials.

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ELIDをしたCo-Crのポリエチレンによるにおける , , , , , , , , = Journal of the Japan Society of Grinding Engineers 56(3), 184-189,

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Enter the password to open this PDF file: Cancel OK. File name:-

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Abstract— The Centerless grinding machine primarily facilitates the ease of grinding processes of bulk and big mechanical component's which are difficult to... Read more ELID grinding of silicon wafers: a literature review - ResearchGate

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DeepDyve is the largest online rental service for scholarly research with thousands of academic publications available at your fingertips.

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Liu, Z. J. Pei and G. Fisher, "ELID Grinding of Silicon Wafers: A literature review", International Journal of Machine Tools and Manufacture, 47 [3-4] (2006) 529-536. 4. A.H. Tan and Y.C. Cheng, "Wear-corrosion Properties of Diamond Conditioners in CMP Slurry", Wear, 262 (2007) 693-698.

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Single crystal sapphire is of significant interest due to its combination of excellent optical, electrical, and mechanical properties. However, fine grinding of sapphire is quite challenging because of its high hardness and low fracture toughness, making it sensitive to cracking. Wheel loading is a common problem in conventional grinding of hard and brittle materials. ELID grinding shows great ...

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Textured grinding wheels: A review. By Hao Nan Li. Tribology of Abrasive Machining Processes. By Ioan Marinescu. Analytical modeling of grinding wheel loading phenomena. By Ahmed A D Sarhan. Grinding temperature and wheel wear of porous metal-bonded cubic boron nitride superabrasive wheels in high- efficiency deep grinding.

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ELID grinding of silicon wafers: a literature review Liu, JH; Pei, ZJ; Fisher, GR A study on wear mechanism and wear reduction strategies in grinding wheels used for ELID grinding

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Simultaneous double-side grinding (SDSG) has become an important flattening process for manufacturing of 300 mm silicon wafers. However, the literature contains only a small number of papers on SDSG. In contrast, there are a large number of patents pertinent to this process.

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Diamond has been exclusively used as the abrasives in the grinding wheels for ELID grinding of silicon wafers. The diamond grain sizes ranged from #1200 (average grain diameter ≈ 7 µm) to in ELID grinding were much smaller than that used in conventional wafer fine grinding. The bonds used in ELID wheels were mostly metal bonds [9,13,14,16].

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PDF A Literature Review of Energy Efficiency and . Aug 10 2021 A Literature Review of Energy Efficiency and Sustainability in i.e milling turning and drilling and the grinding computer numerical control machine is supplied by the electric grid . Chat Online; Do s and Don ts of Power Wire Brushes Norton Abrasives

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Simultaneous double side grinding of silicon wafers: a literature review Z.C. Lia, Z.J. Peia,, Graham R. Fisherb ... [5,10,20,26,51,54] silicon wafers were reported. Use of grinding wheels whose diameters are equal or greater than the wafer diameter [55,57–60] and use of grinding wheels whose diameters were less than the wafer diameter

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As silicon wafers are grinded thinner, the more it becomes sensitive to mechanical stress and vibration. The conventional mechanical dicing process induce a ... LITERATURE REVIEW Dicing before grinding or DBG is a reverse flow of the standard wafer preparation process,

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Surface roughness characteristics of fine ELID cross grinding for silicon wafers were discussed. In an optimized condition, surface roughness of 2.2 nm in Ra can be achieved by using #20000 wheel ...

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International Journal of Machine Tools & Manufacture 47 (2007) 529–536 ELID grinding of silicon wafers: A literature review J.H. Liua, Z.J. Peia,, Graham R. Fisherb aDepartment of Industrial and Manufacturing Systems Engineering, Kansas State University, 237 Durland Hall, Manhattan, KS 66506 5101, USA bMEMC Electronic Materials, Inc., 501 Pearl Drive, St. Peters, MO 63376, USA

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In addition, ELID grinding of silicon wafers was done on a horizontal spindle surface grinding machine using a straight type wheel, as shown in Fig. 10. This set-up would make it possible to grind a large wafer without using a large grinding wheel. The silicon wafer (workpiece) was held on a …

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Publication Info. Home; Publications; Publication Info.

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ELID-GRINDING TECHNIQUE. Figure 1 show the ELID-grinding principle, which was invented through the application of cast iron bonded diamond (CIB-D) wheels to silicon wafers. The wheel becomes the positive pole by a brush smoothly contacting its surface. The electrode fixed below the wheel surface is the negative pole.

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A mirror surface was achieved on silicon nitride materials when ELID grinding was performed using a 4000 grit-size wheel. The finish ELID technology will find wide application in the optical and semiconductor industries such as mirror finishing of silicon wafers, many kinds of …

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This review paper discusses historical perspectives on grinding of silicon wafers, impacts of wafer size progression on applications of grinding in silicon wafer manufacturing, and interrelationships between grinding and two other silicon machining processes (slicing and polishing). It is intended to help readers to gain a more….

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Yang LJ, Ren CZ, Jin XM (2010) Experimental study of ELID grinding based on the active control of oxide layer. J Mater Process Technol 210:1748–1753. Article Google Scholar 14. Liu JH, Pei ZJ, Fisher, Graham R (2007) ELID grinding of silicon wafers: a literature review. Int J Mach Tools Manuf 47:529–536

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： Qin Tina ： ： ： ： [email protected] ： ： ： [email protected] ： Lecturer ：

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Liu J H, Pei Z J and Fisher G R 2007 Grinding wheels for manufacturing of silicon wafers: a literature review Int. J. Mach. Tools Manuf. 47 1-13. Crossref. Liu J H, Pei Z J and Fisher G R 2007 ELID grinding of silicon wafers: a literature review Int. J. Mach. Tools Manuf. 47 529-36. Crossref. Basim G, ...

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Nanoscale solely amorphous layer is achieved in silicon (Si) wafers, using a developed diamond wheel with ceria, which is confirmed by high resolution transmission electron …

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Silicon (Si) wafers are widely used substrates for fabricating more than 90% of the semiconductor devices 1.Si has dominated both the semiconductor and electronics industries for several decades 2,3.Silicon wafers experience successive machining processes after slicing from an ingot, such as lapping, ultraprecision grinding, chemical mechanical polishing (CMP), etc. Ultraprecision grinding …

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J. H. Liu and Z. J. Pei, ELID Grinding of Silicon Wafers: A Literature Review, International Journal of Machine Tools and Manufacture 47 (2007), 529–536. 16. H. S. Lim, K. Fathima, K. A. Senthil, and M. Rahman, A Fundamental Study on the Mechanism of Electrolytic In-Process Dressing (ELID) Grinding, International Journal of Machine Tools and ...

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